ASIC Development Services

ASIC Design

IP Development, RTL Coding, Circuit Design, Physical Design

Providing architecture, front-end, back-end, or turnkey ASIC design services for digital, mixed signal, and custom analog systems with expertise in radiation hardening by design.

Wafer Foundry Services

Wafer Fabrication, Processing, Test

Foundry partnerships enable access to technology from >1 micron to <12nm.  CMOS, SOI, FinFET, SiGe, BiCMOS, SiC, and GaN options. Wafer processing and test services including bumping, thinning, dicing, and electrical test.

Assembly Services

Custom Package Design, Die Assembly

Custom design of ceramic, plastic, or organic packages. Assembly following MIL-PRF-38534/5 standards. Specialty in the design of high-reliability and space-level packages. 

Test & Screening Services

Electrical, Functional, & Radiation Test

Testing performed in accordance with  MIL-STD-883 and MIL-PRF-38534/5. Expertise in device characterization, lot qualification, and  comprehensive radiation effects testing. 

System-in-Package Services

Substrate Design Services

High Density Package Design

System-in-Package (SiP) or Multi-Chip-Module (MCM) design using silicon interposers with TSVs, ceramic, or plastic substrates. IC/package/PCB co-design methodology and analysis.

Assembly & Test Services

Turnkey SiP Fabrication, Assembly, Test

Single source for substrate fabrication, assembly, and test. Our manufacturing partners enable solutions for high-reliability, high-density assemblies. Full MIL-PRF-38534 test and qual services.

Supply Chain Services

Upscreening Services

Temperature, Radiation, Environment

Specialized upscreening of commercial off the shelf (COTS) components for use in extended operating environments. Expertise radiation hardened upscreening.

Procurement Services

Custom Part Numbers and SCDs 

Turnkey procurement services make microelectronic purchases easier. Custom source control drawings, part numbers, and documentation for easy die or part procurement.