Analog/Mixed Signal Design
Our custom IC design team can implement analog/mixed-signal ICs from concept to production part delivery. The team excels in the design of IP and chips for high speed communication interfaces, clocks, reference generators, power management, amplifiers, filters, and data convertors. Designs have been implemented on bulk CMOS, SOI, Bi-CMOS, FinFET, and SiGe processes at a wide variety of foundries and geometries. Radiation hardening by design is applied to the analog/mixed signal design when required by the end application.
ASIC/SoC Design
ASIC/SoC design capabilities include architecture development, RTL coding, IP integration, synthesis, layout, physical design and verification. Design-for-test and design-for-manufacturing implemented during the chip development enabling assembly and test. Designs have been implemented on bulk CMOS, SOI, FinFET and RibbonFET technologies down to 1.8nm. Radiation hardening by design is implemented in the ASIC/SoC as required by the end application.
IP Development
Trusted Semiconductor Solutions excels in semiconductor IP development creating both hard and soft IP blocks for a variety of foundry technologies. Our team specializes radiation hardened IP and the development of custom analog, digital, and mixed signal building blocks for chiplets and SoCs. All IP is silicon validated and available for license.
Radiation Hardening
Trusted Semiconductor Solutions has expertise in radiation effects analysis, radiation mitigation through circuit design and layout, and radiation testing of microelectronics. TCAD simulation services are performed on semiconductor devices to assess radiation impact. Radiation hardening by design is implemented on digital, analog, or mixed signal IP and integrated circuit designs. Total dose, dose rate, single event effects, neutron, and proton radiation testing services are offered to characterize performance of microelectronics.
Wafer Foundry Services
Foundry partnerships enable access to technology from State-of-the-Practice (45nm and above) to State-of-the-Art (sub-28nm). Trusted Semiconductor Solutions products are developed on CMOS, SOI, FinFET, SiGe, BiCMOS, Bipolar and Gate-All-Around (GAA) technologies. Wafer processing and test enables delivery of known-good-die and package assemblies.
Package Design & Assembly
Our IC package design team develops custom packages for ICs, hybrids, System-in-Package, and multi-chip modules. We utilize a wide variety of organic, glass, silicon, and ceramic materials for packages and can support wirebond, flipchip, die-to-die bonding, and high-density interconnect assemblies. Our team performs signal integrity, thermal, and power analyses to ensure high-performance of the devices once packaged.
Testing and Screening
Test and screening includes electrical, environmental, functional, mechanical, radiation, and reliability testing. Trusted Semiconductor Solutions specializes in testing of high-reliability microelectronics and space electronics. Our team also conducts failure analysis testing and device qualification testing. We routinely test to the MIL-STD and ESCC standards with expertise in device characterization, lot qualification, and comprehensive radiation effects testing.
Board Design
Trusted Semiconductor Solutions develops board-level products from concept to full-scale production. Architecture development, schematic design, layout, PCB fabrication, bill-of-material management, assembly, and test are included in our board design capabilities.
Procurement Services
Trusted Semiconductor Solutions creates custom source control drawings, part numbers, and documentation to enable procurement of microelectronics in a variety of embodiments. Wafers, known-good-die (KGD), packaged parts, upscreened devices, cards, or boards can be procured as commercial-off-the-shelf (COTS) devices.