Company Description:
Trusted Semiconductor Solutions provides integrated circuit development services from concept to qualified part delivery leveraging the best-in-class on-shore manufacturing capabilities. Trusted Semiconductor Solutions specializes in IC design and high-density package solutions with expertise in radiation hardening for space and strategic applications. Trusted Semiconductor Solutions is a Trusted accredited supplier and a non-traditional defense contractor. For more information, please visit: www.trustedsemi.com.
Trusted Semiconductor Solutions plans to have openings for full-time entry-level engineers.
Please Note: Applicants must be a U.S. Citizen, U.S. Permanent Resident, Political Asylee, or Refugee to be considered for this position.
Job Description:
TSS is seeking a motivated Entry-Level IC Package Design Engineer with a focus on mechanical and thermal analysis. In this role, you will support the design and development of advanced semiconductor packaging solutions, ensuring reliability and performance under a variety of mechanical and thermal conditions. This opportunity includes exposure to leading-edge packaging techniques such as 2.5D, 3D, and chiplets. This opportunity applies mechanical engineering and materials science to the semiconductor industry.
Responsibilities:
- Assist in the design and analysis of IC packages (e.g., wirebond, flip-chip, 2.5D/3D, wafer-level packages).
- Perform thermal modeling and simulation (steady-state and transient) to evaluate package heat dissipation.
- Conduct mechanical stress/strain simulations (e.g., warpage, CTE mismatch, solder fatigue, delamination risks).
- Support reliability assessments, including thermal cycling, drop, and vibration studies.
- Collaborate with cross-functional teams (silicon design, substrate layout, materials, and reliability engineering).
- Document design assumptions, analysis results, and recommendations.
- Learn and apply industry-standard simulation tools for thermal and mechanical analysis.
- Participate in design reviews and contribute to continuous improvement of packaging methodologies.
Qualifications:
- Bachelor’s degree in Mechanical Engineering, Materials Science, Electrical Engineering, or related field.
- Coursework or project experience in heat transfer, thermodynamics, solid mechanics, or finite element analysis (FEA).
- Familiarity with FEA and thermal simulation tools (ANSYS, Siemens, Icepak, etc.) a plus.
- Basic understanding of semiconductor packaging technologies desirable.
- Strong problem-solving, teamwork, and communication skills.
- Programming/scripting skills (Python, Matlab, or similar) beneficial for data analysis and automation.