ASIC Development Services
IP Development, RTL Coding, Circuit Design, Physical Design
Providing architecture, front-end, back-end, or turnkey ASIC design services for digital, mixed signal, and custom analog systems with expertise in radiation hardening by design.
Wafer Foundry Services
Wafer Fabrication, Processing, Test
Foundry partnerships enable access to technology from >1 micron to <12nm. CMOS, SOI, FinFET, SiGe, BiCMOS, SiC, and GaN options. Wafer processing and test services including bumping, thinning, dicing, and electrical test.
Custom Package Design, Die Assembly
Custom design of ceramic, plastic, or organic packages. Assembly following MIL-PRF-38534/5 standards. Specialty in the design of high-reliability and space-level packages.
Test & Screening Services
Electrical, Functional, & Radiation Test
Testing performed in accordance with MIL-STD-883 and MIL-PRF-38534/5. Expertise in device characterization, lot qualification, and comprehensive radiation effects testing.
Substrate Design Services
High Density Package Design
System-in-Package (SiP) or Multi-Chip-Module (MCM) design using silicon interposers with TSVs, ceramic, or plastic substrates. IC/package/PCB co-design methodology and analysis.
Assembly & Test Services
Turnkey SiP Fabrication, Assembly, Test
Single source for substrate fabrication, assembly, and test. Our manufacturing partners enable solutions for high-reliability, high-density assemblies. Full MIL-PRF-38534 test and qual services.
Supply Chain Services
Temperature, Radiation, Environment
Specialized upscreening of commercial off the shelf (COTS) components for use in extended operating environments. Expertise radiation hardened upscreening.
Custom Part Numbers and SCDs
Turnkey procurement services make microelectronic purchases easier. Custom source control drawings, part numbers, and documentation for easy die or part procurement.